Process for treating polishing cloths used for semiconductor waf

Details Process for treating polishing cloths used for semiconductor waf Process for treating polishing cloths used for semiconductor waf

1990-06-05

1992-12-01

Willis, Jr., Prince

Bleaching and dyeing; fluid treatment and chemical modification

Cleaning or laundering

Removing formation impurities from artifical fiber

68 43, 134 34, 134 36, D06B 500

Patent

active

051676672

ABSTRACT:
In the chemo-mechanical polishing, in particular, of semiconductor wafers, he abrasion and the geometrical quality of the wafers decreases with increasing service life of the polishing cloth. This can be prevented by treating the polishing cloth in each case after the polishing operation in a manner such that a pressure field is impressed, essentially without mechanical stress, on the polishing cloth, which pressure field causes a treatment liquid to flow through the interior of the polishing cloth and in this process the residues produced during polishing are rendered mobile and removed. A baseplate placed transversely across the polishing cloth and having a flat working surface provided with exit openings for the treatment liquid is suitable for carrying out the process. In the treatment, the treatment liquid is forced beneath the baseplate into the moving polishing cloth so that the latter is gradually traversed by the zone through which flow takes place.

REFERENCES:
patent: 3919101 (1975-11-01), Anstett et al.
patent: 4219333 (1980-08-01), Harris
patent: 4968380 (1990-11-01), Prigge

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