Process for treating diamond grains

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156644, 156DIG68, 51293, 51296, 51309, B24D 302, B24D 1700, B24D 1800

Patent

active

050357719

ABSTRACT:
Diamond grains utilized in cutting tools and usually held in a bond, specifically metallic bond are subjected to a pretreatment which enlarges their surface to at least twice their natural surface area. The pretreatment includes embedding the diamond grains in a metal powder, and exposing the embedded grains to a stream of hydrogen or hydrogen-containing gas at a temperature above 700.degree. C. until pores are etched in contact areas of the diamonds with the metal particles. The pretreated diamond grains are then purified with an acid to remove the metal particles and other residues.

REFERENCES:
patent: 3957461 (1976-05-01), Lindstrom et al.
patent: 4247305 (1981-01-01), Daniels et al.
patent: 4738689 (1988-04-01), Gigl et al.
patent: 4805586 (1989-02-01), Borse
R. M. German, Powder Metallurgy Science, M.P.I.F., pp. 188-193, 1984.

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