Process for treating brass components to reduce leachable lead

Details Process for treating brass components to reduce leachable lead Process for treating brass components to reduce leachable lead

1997-01-07

1999-09-28

Housel, James C.

Etching a substrate: processes

Etching of semiconductor material to produce an article...

134 2, 134 3, 148525, 148545, 148553, 148558, 216105, 216106, 216 94, C23C 2263

Patent

active

059582570

ABSTRACT:
A process for the treatment of brass components to reduce leachable lead therefrom when the component is exposed to water in which the brass component is first treated with an aqueous caustic solution to remove some of the leachable lead therefrom. Thereafter, the brass component is leached to remove excess caustic and then contacted with a water soluble carboxylic acid to remove most of the remaining leachable lead. It has been found that the efficiency of the process can be significantly enhanced through the use of ultrasonic agitation to ensure intimate contact between the treating solutions and the brass component. In the practice of the invention, the amount of lead removed is sufficient to meet the most stringent regulatory requirements for water quality.

REFERENCES:
patent: 4333785 (1982-06-01), Erickson
patent: 5601658 (1997-02-01), Marinas et al.

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