Process for thinning a semiconductor workpiece

Details Process for thinning a semiconductor workpiece Process for thinning a semiconductor workpiece

2007-10-30

2007-10-30

Vinh, Lan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

C438S455000, C438S458000, C438S459000, C438S690000, C438S693000, C216S011000, C216S048000, C216S088000, C216S089000, C257S753000, C257S787000, C257S788000, C257S789000, C257S790000, C257S791000, C257S792000

Reexamination Certificate

active

10923363

ABSTRACT:
The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a body, a retainer removeably attached to the body and a seal forming member. When a workpiece is placed on the chuck body and the retainer is engaged to the body, a peripheral portion of the back side of the workpiece is covered by the retainer while an interior region of the back side of the workpiece is exposed. The exposed back side of the workpiece is then subjected to a wet chemical etching process to thin the workpiece and form a relatively thick rim comprised of semiconductor material at the periphery of the workpiece. The thick rim or hoop imparts strength to the otherwise fragile, thinned semiconductor workpiece. Semiconductor workpieces made according to the present invention offer an improved structure for handling thinned wafers in conventional automated equipment. This results in improved yields and improved process efficiency.

REFERENCES:
patent: 4903717 (1990-02-01), Sumnitsch
patent: 4946716 (1990-08-01), Corrie
patent: 5127984 (1992-07-01), Hua et al.
patent: 5232511 (1993-08-01), Bergman
patent: 5234540 (1993-08-01), Grant et al.
patent: 5235995 (1993-08-01), Bergman et al.
patent: 5248380 (1993-09-01), Tanaka
patent: 5256599 (1993-10-01), Asetta et al.
patent: 5268065 (1993-12-01), Grupen-Shemansky
patent: 5275958 (1994-01-01), Ishikawa
patent: 5277769 (1994-01-01), Medernach
patent: 5279703 (1994-01-01), Haberger et al.
patent: 5423944 (1995-06-01), Wong
patent: 5476566 (1995-12-01), Cavasin
patent: 5513668 (1996-05-01), Sumnitsch
patent: 5762391 (1998-06-01), Sumnitsch
patent: 5896875 (1999-04-01), Yoneda
patent: 5896877 (1999-04-01), Pirker
patent: 5904164 (1999-05-01), Wagner et al.
patent: 5922624 (1999-07-01), Verhaverbeke et al.
patent: 5927993 (1999-07-01), Lesk et al.
patent: 5931518 (1999-08-01), Pirker
patent: 5948699 (1999-09-01), Lawrence et al.
patent: 5967578 (1999-10-01), Frey
patent: 6046073 (2000-04-01), Lang et al.
patent: 6056208 (2000-05-01), Pirker et al.
patent: 6056825 (2000-05-01), Sumnitsch
patent: 6109677 (2000-08-01), Anthony
patent: 6149759 (2000-11-01), Guggenberger
patent: 6152507 (2000-11-01), Pirker
patent: 6153536 (2000-11-01), Brouillette et al.
patent: 6162703 (2000-12-01), Muntifering et al.
patent: 6162739 (2000-12-01), Sumnitsch et al.
patent: 6169038 (2001-01-01), Kruwinus et al.
patent: 6193798 (2001-02-01), Sumnitsch
patent: 6316367 (2001-11-01), Sumnitsch
patent: 6322903 (2001-11-01), Siniaguine et al.
patent: 6328846 (2001-12-01), Langen et al.
patent: 6342434 (2002-01-01), Miyamoto et al.
patent: 6350664 (2002-02-01), Haji et al.
patent: 6383331 (2002-05-01), Sumnitsch
patent: 6385863 (2002-05-01), Kruwinus
patent: 6402843 (2002-06-01), Siniaguine et al.
patent: 6420209 (2002-07-01), Siniaguine
patent: 6435200 (2002-08-01), Langen
patent: 6448153 (2002-09-01), Siniaguine et al.
patent: 6492195 (2002-12-01), Nakanishi et al.
patent: 6494221 (2002-12-01), Sellmer et al.
patent: 6497765 (2002-12-01), Nice
patent: 6497768 (2002-12-01), Bergman
patent: 6498074 (2002-12-01), Siniaguine et al.
patent: 6500764 (2002-12-01), Pritchett
patent: 6506681 (2003-01-01), Grigg et al.
patent: 6524881 (2003-02-01), Tandy et al.
patent: 6536454 (2003-03-01), Lindner
patent: 6551905 (2003-04-01), Barsky et al.
patent: 6573158 (2003-06-01), Miyamoto et al.
patent: 6608370 (2003-08-01), Chen et al.
patent: 6627548 (2003-09-01), Kruwinus et al.
patent: 6699356 (2004-03-01), Bachrach et al.
patent: 6713366 (2004-03-01), Mong et al.
patent: 6717254 (2004-04-01), Siniaguine
patent: 6730595 (2004-05-01), Saimoto et al.
patent: 6803294 (2004-10-01), Kouno et al.
patent: 6940181 (2005-09-01), Derderian et al.
patent: 2002/0048907 (2002-04-01), Miyamoto et al.
patent: 2002/0061642 (2002-05-01), Haji et al.
patent: 2003/0119281 (2003-06-01), Suzuki et al.
patent: 0 548 596 (1993-06-01), None
patent: 11-121466 (1999-04-01), None

Affiliated with

Also associated with

Rating

Process for thinning a semiconductor workpiece does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for thinning a semiconductor workpiece, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for thinning a semiconductor workpiece will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3859338