Process for the wet chemical treatment of semiconductor wafers

Details Process for the wet chemical treatment of semiconductor wafers Process for the wet chemical treatment of semiconductor wafers

2007-02-06

2007-02-06

Gupta, Yogendra N. (Department: 1722)

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

C438S750000, C438S751000, C438S752000, C438S753000, C438S734000, C438S749000, C438S703000, C134S003000, C134S025400

Reexamination Certificate

active

09425694

ABSTRACT:
A process for the wet chemical treatment of semiconductor wafers, in which the semiconductor wafers are treated with treatment liquids, has the semiconductor wafers firstly treated with an aqueous HF solution, then treated with an aqueous O3solution and finally treated with water or an aqueous HCl solution, these treatments forming a treatment sequence.

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Abstract for JP 4-26 120 A.
Abstract [1983:45 13 999] for Proceedings of the second Int. Symp. on Cleaning Techn. in Semiconductor Device Manufacturing, Electrochem. Soc., 1992 pp. 18-25.
M. Meuris et al., Solid State Technologie, Jul. 95, p. 109.
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The English Derwent Abstract 1996-404246[41] corresp. to EP 0731495A2 is enclosed.

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