Process for the wet-chemical treatment of semiconductor surfaces

Details Process for the wet-chemical treatment of semiconductor surfaces Process for the wet-chemical treatment of semiconductor surfaces

1990-12-12

1991-09-24

Morris, Theodore

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 41, 252142, 252143, 156640, 156662, C23G 102

Patent

active

050511343

ABSTRACT:
In the treatment of semiconductor slices, in particular silicon slices, w aqueous solutions containing hydrofluoric acid, a contamination of the slice surface with particles which interfere with the subsequent processes has been observed. This increase in particles can be markedly decreased by additionally adding to the solutions, organic ring molecules capable of forming inclusion compounds, such as, for instance, cyclodextrins, and/or acids with pKa below 3.14 which are incapable of oxidizing the semiconductor material. The actual treatment can be carried out in the usual way, for example, in immersion baths.

REFERENCES:
patent: 4885056 (1989-12-01), Hall et al.

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