Process for the self fractionation deposition of a metallic laye

Details Process for the self fractionation deposition of a metallic laye Process for the self fractionation deposition of a metallic laye

1988-08-29

1989-10-24

Childs, Sadie

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 46, 427124, 427125, 427250, B05D 302, C23C 1606

Patent

active

048761141

ABSTRACT:
A process for the evaporation deposition of a layer of metal on a workpiece is described in which a charge of a metal is placed in a crucible formed of a material having a vapor pressure lower than the vapor pressure of the metal at a selected temperature, a shield is placed between the workpiece and the crucible, and the crucible is then heated to a first temperature sufficient to melt said charge, but insufficient to cause substantial evaporation of said charge following which the crucible is heated to a second temperature level for a time sufficient to fractionally distill the charge and sublime or vaporize any non-metallic contaminants in said charge and finally the crucible is heated to a third temperature sufficient to evaporate the charge at a selected rate at which time the shield is removed from between the cricuble and the workpiece to permit evaporant from the charge to coat the workpiece.

REFERENCES:
patent: 3401055 (1968-09-01), Langdon et al.
patent: 3505131 (1970-04-01), Wells
patent: 3576670 (1971-04-01), Hammond
patent: 3775157 (1973-11-01), Fromson
patent: 3934059 (1976-01-01), Polinsky
patent: 3985281 (1976-10-01), Diepers et al.
patent: 4061800 (1977-12-01), Anderson
patent: 4426569 (1984-01-01), Miller et al.
patent: 4472453 (1984-09-01), Hoffmann
patent: 4791261 (1988-12-01), Phinney et al.

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