Process for the selective control of feature size in...

Details Process for the selective control of feature size in... Process for the selective control of feature size in...

2005-12-06

2005-12-06

Lin, Sun James (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000

Reexamination Certificate

active

06973637

ABSTRACT:
The present invention provides a non-global process for designing an integrated circuit layout. The process comprises locating an isolated layout feature of an integrated circuit layout and non-globally changing at least one lateral dimension of the isolated layout feature to obtain an optimized increment. The change in lateral dimension by the optimized increment does not violate a minimum separation distance between the isolated layout feature and the other adjacent layout features. The process may be incorporated into a system for non-globally modifying an integrated circuit layout, described in a data file or an integrated circuit design system.

REFERENCES:
patent: 4895780 (1990-01-01), Nissan-Cohen et al.
patent: 5723233 (1998-03-01), Garza et al.
patent: 6225134 (2001-05-01), Meisner
patent: 6269472 (2001-07-01), Garza et al.
patent: 6275971 (2001-08-01), Levy et al.
patent: 6335130 (2002-01-01), Chen et al.
patent: 6370679 (2002-04-01), Chang et al.
patent: 6444373 (2002-09-01), Subramanian et al.
patent: 6596444 (2003-07-01), Buck
patent: 6783904 (2004-08-01), Strozewski et al.
patent: 2002/0152453 (2002-10-01), Rittman

Affiliated with

Also associated with

Rating

Process for the selective control of feature size in... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for the selective control of feature size in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the selective control of feature size in... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3477145