Process for the production of solder masks for printed circuits

Details Process for the production of solder masks for printed circuits Process for the production of solder masks for printed circuits

1978-11-15

1980-10-28

Silverberg, Sam

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430935, 427 96, 427420, G03C 500

Patent

active

042307937

ABSTRACT:
A process for producing solder masks on double sided printed circuit boards, comprising conveying the boards beneath a free falling curtain of a pohotopolymer to form a thin layer on a surface of the board, irradiating with ultra violet light areas of the surface other than those that need to be soldered and then, by subsequent development, dissolving the unirradiated areas of the layer. The viscosity of the photopolymer is between 500 to 1200 mPa's at impingement on the surface of the circuit and the height of the curtain is selected so that the rate of flow of the polymer onto the circuit is between 60 to 160 m/min. Also the rate at which the circuits are conveyed beneath the curtain is greater than a rate slightly less than the rate at which the polymer flows onto the circuit.

REFERENCES:
patent: T857041 (1968-12-01), Eells
patent: 2963002 (1960-12-01), Glaus
patent: 3132968 (1964-05-01), Wandtke
patent: 3205089 (1965-09-01), Kinzelman
patent: 3500610 (1970-03-01), Chenoweth
patent: 3876465 (1975-04-01), Prazak
patent: 4018940 (1977-04-01), Morgan
patent: 4064287 (1977-12-01), Lipson
patent: 4150169 (1979-04-01), Bagley
patent: 4153855 (1979-05-01), Feingold

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