Process for the production of semiconductor devices

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437235, 427228, 4271262, B05D 302

Patent

active

056020600

ABSTRACT:
Process for the production of semiconductor devices comprising the steps of applying a solution of the specified polycarbosilane in a solvent onto a substrate having electrically conductive components fabricated therein, and curing the coated layer of the polycarbosilane at a temperature of not less than 350.degree. C. in an oxidizing atmosphere to thereby covert the polycarbosilane layer to a silicon oxide layer. The resulting silicon oxide layer has a planarized surface and has no cracking and accordingly is useful as a dielectric layer and a protective layer in the production of semiconductor devices having a high reliability.

REFERENCES:
patent: 4220600 (1980-09-01), Yajima et al.
patent: 4650837 (1987-03-01), Seyferth et al.
patent: 4756977 (1988-07-01), Haluska et al.
patent: 5059448 (1991-10-01), Chandra et al.
patent: 5138080 (1992-08-01), Jung et al.
patent: 5370903 (1994-12-01), Mine et al.
patent: 5380555 (1995-01-01), Mine et al.
patent: 5387480 (1995-02-01), Haluska et al.
patent: 5399441 (1995-03-01), Bearinger et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for the production of semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for the production of semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the production of semiconductor devices will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-341670

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.