Process for the production of printed circuits with solder rejec

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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1566611, 156664, 156666, 156901, 204 15, 204 23, 204 32R, 204 38S, 427258, 427272, 427307, H05K 306

Patent

active

042683491

ABSTRACT:
A process for the production of printed circuit boards having first zones of a wiring pattern for receiving solder and second sub-zones provided with solder rejecting properties so that they do not receive solder, characterized by galvanically applying a solderable etch-resistant metal layer on the first sub-zones of each conductive metal layer, by photo printing a mask of etch-resistant material on the second sub-zones, etching to remove the exposed portions of the conductive metal layer, removing the mask from the second sub-zones and providing the exposed second sub-zones with a solder rejecting property with the aid of passivation without impairing the solderability of the etch-resistant metal layers of the first sub-zones.

REFERENCES:
patent: 3443988 (1969-05-01), McCormack et al.
patent: 3599326 (1971-08-01), Direnzo
patent: 3610811 (1971-10-01), O'Keefe
patent: 3691632 (1972-09-01), Smith
patent: 3702284 (1972-11-01), Merkenschlager
patent: 3754324 (1973-08-01), Krehbiel et al.
patent: 3945826 (1976-03-01), Freidman et al.
patent: 3990982 (1976-11-01), Dixon

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