Process for the production of printed circuits with solder rejec

Details Process for the production of printed circuits with solder rejec Process for the production of printed circuits with solder rejec

1976-09-15

1981-05-19

Massie, Jerome W.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566611, 156664, 156666, 156901, 204 15, 204 23, 204 32R, 204 38S, 427258, 427272, 427307, H05K 306

Patent

active

042683491

ABSTRACT:
A process for the production of printed circuit boards having first zones of a wiring pattern for receiving solder and second sub-zones provided with solder rejecting properties so that they do not receive solder, characterized by galvanically applying a solderable etch-resistant metal layer on the first sub-zones of each conductive metal layer, by photo printing a mask of etch-resistant material on the second sub-zones, etching to remove the exposed portions of the conductive metal layer, removing the mask from the second sub-zones and providing the exposed second sub-zones with a solder rejecting property with the aid of passivation without impairing the solderability of the etch-resistant metal layers of the first sub-zones.

REFERENCES:
patent: 3443988 (1969-05-01), McCormack et al.
patent: 3599326 (1971-08-01), Direnzo
patent: 3610811 (1971-10-01), O'Keefe
patent: 3691632 (1972-09-01), Smith
patent: 3702284 (1972-11-01), Merkenschlager
patent: 3754324 (1973-08-01), Krehbiel et al.
patent: 3945826 (1976-03-01), Freidman et al.
patent: 3990982 (1976-11-01), Dixon

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