Process for the production of adhesive metal layers on non-condu

Details Process for the production of adhesive metal layers on non-condu Process for the production of adhesive metal layers on non-condu

1980-04-18

1982-12-21

Page, Thurman K.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156643, 204192R, 204192C, 427 36, 427 99, 427250, 427307, 427309, B44C 122, B05D 306

Patent

active

043647928

ABSTRACT:
Known process for the metallization of non-conductors, particularly synthetic resins, by chemical deposition, evaporation, or sputtering operate with adhesion facilitating intermediate layers such as e.g. varnishes or pastes. There is not attained sufficient adhesiveness with these adhesion facilitators for many areas of use. Besides the adhesive facilitator can cause troubles in later processing. Therefore there is described a process in which the surface area to be coated is roughened by means of a preliminary etching before by the metallizing and wherein this surface area before the etching is exposed to a heavy ion radiation.

REFERENCES:
patent: 3262808 (1966-07-01), Crooks et al.
patent: 3547683 (1970-12-01), Williams et al.
patent: 3914472 (1975-10-01), Nakanishi et al.
patent: 3930066 (1975-12-01), Ryan et al.

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