Process for the production of a structure having a thin semicond

Details Process for the production of a structure having a thin semicond Process for the production of a structure having a thin semicond

1995-09-18

1999-01-26

Geist, Gary

Semiconductor device manufacturing: process

Formation of semiconductive active region on any substrate

438479, 438480, C30B 2500

Patent

active

058638300

ABSTRACT:
A process for the production of a structure having a thin semiconductor film (2) adhering to a target substrate (24). The process which is applicable to the production of electronic components comprises the steps of

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Japanese Journal of Applied Physics, vol. 23, No. 10, Oct. 1984 Tokyo, JP, pp. L815-L817, T. Hamguchi et al., Device Layer Transfer-Technique Using Chemi-Mechanical Polishing.
Proceedings of the fifteenth international symposium on gallium arsenide and related compounds, 1988, 1988 Bristol pp. 387-392, XP 000000001, J.F. Klem, et al., Characteristics of Lift-off Fabricated Algaas/ Ingaas, single-Strained, etc..
Japanese Journal of Applied Physics, Part I, 1989, Japan vol. 28, No. 8 ISSN 0021-4922, pp. 1426-1443, Haisma J. et al. Silicon-On-Insulator Wafer Bonding-Wafer Thinning Technological Evaluations.

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