Process for the production of a planar conductor path system for

Details Process for the production of a planar conductor path system for Process for the production of a planar conductor path system for

1976-08-16

1978-07-04

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 156657, 156659, 156665, 427 90, 427 93, B23P 1500, B23P 2506

Patent

active

040986373

ABSTRACT:
Process for the production of a planar conductor path system for integrated semiconductor circuits which includes forming a metal layer on a planar surface of a base, forming a masking layer on the metal layer over those regions where the conductive path is to be, oxidizing electrolessly in acqueous solution those areas of the metal layer not covered by the masking layer.

REFERENCES:
patent: 3723258 (1973-03-01), Podell et al.
patent: 3759798 (1973-09-01), Graff et al.
patent: 3827949 (1974-08-01), Platter et al.
IBM Technical Disclosure Bulletin, vol. 16, No. 3, Aug. 1973, Anodization Process for Planarization of Aluminum-Copper-Silicon Metallurgy by G. Lhote, pp. 1010 and 1011.

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