Plant protecting and regulating compositions – Plant growth regulating compositions – Organic active compound containing
Reexamination Certificate
2005-03-22
2005-03-22
Clardy, S. Mark (Department: 1616)
Plant protecting and regulating compositions
Plant growth regulating compositions
Organic active compound containing
C504S347000, C504S362000, C504S367000, C514S356000, C514S404000, C514S407000, C514S539000, C514S952000
Reexamination Certificate
active
06869914
ABSTRACT:
A process for the preparation of a solvent-free suspension of a low-melting point water-insoluble solid agrochemical active ingredient, which comprises suspending 1-40% by weight of a silica-based carrier in 40 to 97% by weight of water in the presence of 1-40% by weight of anionic dispersant, heating the suspension thus obtained to a temperature above that of the active ingredient, and adding, with stirring, 1-25% by weight of a molten active ingredient with a melting point of <80° C. or a mixture of at least two active ingredients each having a melting point of <80° C. The present invention furthermore relates to the preparation of suspension concentrates, water-dispersible powders and water-dispersible granules based on the suspensions prepared via the abovementioned process.
REFERENCES:
patent: 4571088 (1986-02-01), Frensch et al.
patent: 5137726 (1992-08-01), Ogawa et al.
patent: 6541426 (2003-04-01), Kostansek et al.
patent: 0 112 438 (1984-07-01), None
patent: 1 060 667 (2000-12-01), None
patent: WO 9314632 (1993-08-01), None
Bratz Matthias
Jäger Karl-Friedrich
BASF - Aktiengesellschaft
Clardy S. Mark
Keil & Weinkauf
LandOfFree
Process for the preparation of solvent-free suspensions does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for the preparation of solvent-free suspensions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the preparation of solvent-free suspensions will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3434848