Module board having embedded chips and components and method...

Details Module board having embedded chips and components and method... Module board having embedded chips and components and method...

2005-03-08

2005-03-08

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S763000

Reexamination Certificate

active

06865089

ABSTRACT:
A module board has embedded chips and components. A substrate has at least one large cavity and at least one small cavity, in which the large cavity passes through the substrate and a passive component is set in the small cavity. A heat-dissipation sheet is set at the bottom of the substrate. A first adhesion layer bonds the bottom of the substrate to the heat-dissipation sheet. At least one IC chip is fixed in the large cavity of the substrate by a second adhesion layer. A dielectric filling layer covers the entire surface of the module board and fills all gaps, in which the dielectric filling layer has a plurality of micro vias to expose partial areas of the IC chip, the passive component and the substrate. At least one wiring pattern layer is formed on the dielectric filling layer and provide electrical connection among the IC chip, the passive component, and the substrate.

REFERENCES:
patent: 4931853 (1990-06-01), Ohuchi et al.
patent: 5306670 (1994-04-01), Mowatt et al.
patent: 5422513 (1995-06-01), Marcinkiewicz et al.
patent: 5745984 (1998-05-01), Cole et al.
patent: 5998859 (1999-12-01), Griswold et al.
patent: 6555906 (2003-04-01), Towle et al.

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