Process for the manufacture of substrates to interconnect electr

Details Process for the manufacture of substrates to interconnect electr Process for the manufacture of substrates to interconnect electr

1981-04-14

1985-02-19

Dawson, Robert

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

51326, 156150, 156154, 156155, 1562728, 156278, 156668, 219121LJ, 219121LL, 427271, 428137, B44C 122

Patent

active

045003890

ABSTRACT:
A process for making substrates for interconnecting components in which a filament is applied and affixed to a base in a pre-programmed pattern, the base surface and applied filaments are coated with a coating and the coating is hardened to form a substantially flat surface over the base and filaments. The coated base is then positioned on a table movable along "x" and "y" axes and the coated base is positioned under a high energy beam at pre-programmed points on the applied filament pattern and access openings are formed in the coating on the base at such points to expose the filament at each such point so that the exposed filament can be interfaced with the exposed surface of the coated base and articles for mounting and interconnecting components formed thereby.

REFERENCES:
patent: 3607380 (1971-09-01), Thams
patent: 3674914 (1972-07-01), Burr

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