Process for the manufacture of semiconductor wafers

Details Process for the manufacture of semiconductor wafers Process for the manufacture of semiconductor wafers

1982-02-01

1984-07-24

Bernstein, Hiram H.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156DIG88, C30B 1900

Patent

active

044616716

ABSTRACT:
The invention relates to a process for the direct manufacture of semiconductor wafers, wherein the semiconductor wafers are obtained from molten semiconductor material by providing an area of the surface of the semiconductor melt that corresponds approximately to the size of the wafer with at least one seed crystal, by allowing this area of the surface to cool until it solidifies, the cooling being brought about at least substantially by loss of heat by radiation, and finally, by removing the crystallized-out wafer from the surface. If elemental silicon is used as the semiconductor material, wafers that are suitable for further processing to form solar cells are obtained.

REFERENCES:
patent: 4305776 (1981-12-01), Gradmaier
patent: 4319953 (1982-03-01), Gradmaier
Electronics, v 51, No. 15, 7/78, pp. 44, 46.

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