Process for the manufacture of multi-layer circuits with dynamic

Details Process for the manufacture of multi-layer circuits with dynamic Process for the manufacture of multi-layer circuits with dynamic

1988-05-06

1990-07-31

Dees, Jose

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430318, 430319, G03C 500

Patent

active

049450298

ABSTRACT:
A multilayer through-hole contacted flexible circuit and method of manufacture thereof is presented having a laminar construction which is strictly symmetrical in the bending area; and which has no exposed adhesive. The method comprises the formation of a diclad laminate comprised of an adhesiveless flex circuit (e.g. conductive foil directly on non-conductive flexible carrier film) which is adhered to a second conductive layer using a suitable adhesive. Next, through-holes are formed in the laminate followed by electroless deposition of metal on the through-hole sidewalls. The laminate then undergoes conventional etching processing using photo resist followed by lamination thereof to an adhesive coated polymeric cover film over exposed conductive areas so as to define a dynamic flex region in the area between the through-holes.

REFERENCES:
patent: 3589004 (1971-06-01), Shaheem
patent: 4626462 (1986-12-01), Kober et al.
patent: 4812213 (1989-03-01), Barton et al.

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