Process for the manufacture of an interconnect circuit

Details Process for the manufacture of an interconnect circuit Process for the manufacture of an interconnect circuit

1992-04-01

1993-08-10

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156634, 156644, 1566591, 156902, B44C 122, B29C 3700, C23F 100

Patent

active

052345360

ABSTRACT:
A method for the manufacture of an electronic circuit is provided. A substrate is provided with an indexing means and personality windows by etching. An adhesive is deposited on one surface of the substrate to coat at least those regions to be laminated to a metallic foil. The foil is bonded to the nonconductive substrate and patterned into a plurality of circuit traces. These steps may be repeated a plurality of time for a multi-metal layer structure.

REFERENCES:
patent: Re31967 (1985-08-01), Burns
patent: 2893150 (1959-07-01), Tann
patent: 3301730 (1967-01-01), Spiwak et al.
patent: 3437522 (1969-04-01), Fick et al.
patent: 3448516 (1969-06-01), Buck
patent: 3480836 (1970-08-01), Aronstein
patent: 4087300 (1978-05-01), Adler
patent: 4354895 (1982-10-01), Ellis
patent: 4694572 (1987-09-01), Leber et al.
patent: 4701363 (1987-10-01), Barber
patent: 4927491 (1990-05-01), Masaki
patent: 4982495 (1991-01-01), Okamoto et al.
patent: 4997517 (1991-03-01), Parthasarathi
patent: 5025114 (1991-06-01), Braden
patent: 5062916 (1991-11-01), Aufderheide et al.
patent: 5065228 (1991-11-01), Foster
patent: 5156716 (1992-10-01), Parthasarathi
Electronic Materials Handbook, ASM International, vol. 1, 1989, pp. 476-479.

Affiliated with

Also associated with

Rating

Process for the manufacture of an interconnect circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for the manufacture of an interconnect circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for the manufacture of an interconnect circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1722742