Process for the formation of a conductive circuit pattern

Details Process for the formation of a conductive circuit pattern Process for the formation of a conductive circuit pattern

1992-09-21

1994-03-15

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156638, 156634, 156651, 156656, 156902, B44C 122, C23F 100

Patent

active

052942910

ABSTRACT:
A process is provided for the formation of a conductive circuit pattern on a base metal formed on a substrate. On the base metal, a plating resist is first provided in a pattern corresponding to the circuit to be formed and a circuit pattern is then formed by plating. The plating resist is treated with a stripper and then with a stripping residue remover to cut off chemical bonds in the resist by a dehydrating decomposition reaction. The base metal is treated with an etchant for the base metal, whereby any resist residue still remaining after the treatment with the stripping residue remover is removed and the base metal are etched at areas which were covered by the plating resist.

REFERENCES:
patent: 4157936 (1979-06-01), Piazza
patent: 4304681 (1981-12-01), Martin et al.
patent: 4976808 (1990-12-01), Ogasawara
patent: 5112440 (1992-05-01), Bank et al.

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