Process for smoothing a non-planar surface

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156646, 156653, 156655, 156657, 1566591, 156668, 156904, 20419232, 427 88, B44C 122, C03C 1500, C03C 2506, B29C 1708

Patent

active

046558748

ABSTRACT:
An improvement in the process of constructing an integrated circuit structure in which a photoresist layer is applied to an integrated circuit structure followed by plasma etching of the structure is disclosed which comprises exposing the photoresist material to light, preferably UV light, prior to the etching step whereby the surface of the structure beneath the photoresist will be smooth after the etching step and removal of the photoresist.

REFERENCES:
patent: 4389281 (1983-06-01), Anantha et al.
patent: 4451326 (1984-05-01), Gwozdz

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