Process for sintering aluminum nitride to a high thermal conduct

Details Process for sintering aluminum nitride to a high thermal conduct Process for sintering aluminum nitride to a high thermal conduct

1993-03-30

1994-06-14

Group, Karl

Compositions: ceramic

Ceramic compositions

Refractory

501 96, 501153, 264 65, 264 66, C04B 3558

Patent

active

053209907

ABSTRACT:
Prepare sintered aluminum nitride bodies having a thermal conductivity of at least 200 W/m-K by sintering under non-reducing conditions and controlling interrelated parameters such as binder burnout atmosphere, heating rate, sintering temperature, time at sintering temperature, cooling rate and cooling temperature. Sintered bodies having thermal conductivities in excess of 200, especially in excess of 270, W/m-K result from this process.

REFERENCES:
patent: 4778778 (1988-10-01), Mallia et al.
patent: 4847221 (1989-07-01), Horiguchi et al.
patent: 4897372 (1990-01-01), Huseby et al.
patent: 4952535 (1990-08-01), Merkel
patent: 5034357 (1991-07-01), Yamakawa et al.
Guiton et al., "Optimiazation of Aluminum Nitride Thermal Condictivity Via Controlled Powder Processing", Mat. Res. Soc. Syump. Proc. vol. 271 (1992).
Miyashiro et al., "High Thermal Conductiviy Aluminum Nitide Ceramic Substrates and Packages", IEEE Trans. on Comp., Hybrids, and Manu. Tech. vol. 13, No. 2, Jun. 1990.
Buhr et al., "Phase composition, Oxygen Content, and Thermal Conductivity of AlN(Y.sub.2 O.sub.3) Ceramics", J. Am Ceram. So., 74(4) 718-23 (1991).
Virkar, "Thermodynamic and Kinetic Effects of Oxygen Removal on the Thermal Conductivity of Aluminum Nitride", J. Am. Ceram. so., 72(11) 2031-41 (1989).
Watari et al., "Sintering Chemical Reactions to Increase Thermal Conductivity of Aluminum Nitride", J. Mater. Sci, 26 (1991) 4727-4732.
Yagi et al., "Migration of Grain Boundary phases in AlN Ceramics by Heating in Reduced Atmosphere", Nippon Ceramics Kyokai Gakujutsu Ronbunshi, 97(11) 1372-78 (1989).
Kuramoto et al. "Translucent AlN Ceramic Substrate", Proceedings, 36th ECC (1986).
Kurokawa et al. "Highly Thermal Conductive AlN Substrates", ISHM 1987 Proceedings.
Mizutani et al., "Sintering of AlN", Bull of the Cer Soc. of Japan.
Watari et al., "Thermal Conduction Mechanism of Aluminum Nitride Ceramics", J. Mater. Sci 27 (1992) 2627-2630.
Geith, et al., "Thermal Conductivity of Calcium-doped Aluminum Nitride Ceramics", J. Mater Sci., 28 (1993) 865-869.

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