Methods of forming electrically conductive interconnections and

Details Methods of forming electrically conductive interconnections and Methods of forming electrically conductive interconnections and

1998-02-12

2000-08-29

Booth, Richard

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438108, 438119, 438612, 438613, 438614, 438615, 257778, 257779, 257780, 257781, 257785, 228115, 2281791, 228180, 228 31, 228 41, H01L 2144, H01L 2348, B23K 3102, B23K 2000

Patent

active

061107603

ABSTRACT:
Methods of forming electrically conductive interconnections and electrically interconnected substrates are described. In one implementation, a first substrate having an outer surface is provided and a layer of material is formed thereover. Openings are formed within the layer of material and conductive masses are formed within the openings. A second substrate having conductive interconnect surfaces is provided. The conductive interconnect surfaces are then contacted with the conductive masses and deformed thereby. In one aspect, the interconnect surfaces are deformed in part by portions of the layer of material proximate the conductive masses. In another aspect, the layer of material is removed and the interconnect surfaces are deformed by the conductive masses themselves.

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