Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1984-12-04
1986-09-30
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
148175, 148187, 29576E, 156643, 156644, 156646, 156653, 1566591, 156662, 156649, 357 56, 427 87, C03B 2300, H01L 21205, H01L 21365, H01L 21306
Patent
active
046145648
ABSTRACT:
A process is disclosed for selectively patterning epitaxial film growth on a semiconductor substrate. The process includes forming a masking member on the surface of the substrate, the masking member having at least two layers including a first layer disposed on the substrate and the second layer covering the first layer. A window is then opened in a selected portion of the second layer by removing that portion to expose the first layer thereunder. The first layer is then subjected to an etchant introduced through the window to dissolve a sufficient amount of the first layer to expose the substrate surface directly beneath the window, the first layer being adapted to preferentially dissolve at a substantially greater rate than the second layer so as to create an overhanging ledge portion with the second layer by undercutting the edges thereof adjacent to the window. The epitaxial film is then deposited on the exposed substrate surface directly beneath the window. Finally, an etchant is introduced through the window to dissolve the remainder of the first layer so as to lift-off the second layer and materials deposited thereon to fully expose the balance of the substrate surface.
REFERENCES:
patent: 4111725 (1978-09-01), Cho et al.
patent: 4370510 (1983-01-01), Stinn
patent: 4426767 (1984-01-01), Swanson et al.
Hayes Russell E.
Sheldon Peter
Albrecht John M.
Hightower Judson R.
Powell William A.
Richardson Kenneth L.
The United States of America as represented by the United States
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