Process for selective contact hole filling including a silicide

Fishing – trapping – and vermin destroying

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437200, 437 57, H01L 21283

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active

049668684

ABSTRACT:
A process which provides for self-aligned contact hole filling leading to complete planarization and low contact resistance at the same time, without the use of additional lithographic masking procedures is described. Further, the resultant conductive plug eliminates spiking problems between aluminum and silicon during a subsequent alloying process. In an embodiment, a selective polysilicon layer is deposited and appropriately doped; a second undoped selective silicon layer is then deposited, followed by a refractory metal layer, These layers are heated to produce a self-aligned refractory metal silicide plug.

REFERENCES:
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patent: 4458410 (1984-07-01), Sugaki et al.
patent: 4463491 (1984-08-01), Goldman et al.
patent: 4569123 (1986-02-01), Ishii et al.
patent: 4800177 (1989-01-01), Nakamae
Shatas, S. C., et al., "Heatpulse Rapid . . . , ", Workshop on Refactory Metal Silicides for VLSI, Sep. 1983, pp. 1-19.
Muranka, S. P., J. Vac. Sci. Technol., 17(4), Jul.-Aug., 1980, pp. 775-792.
Ghandi, S. K., VLSI Fabrication Principles, 1983, John Wiley & Sons, pp. 432-435.

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