Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2005-08-02
2005-08-02
Smith, Matthew (Department: 2829)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S050000, C438S052000, C438S106000, C438S112000, C438S113000, C438S126000, C438S127000, C257S787000, C257S788000, C257S789000, C257S795000, C257S414000, C257S417000, C360S294600, C360S244000, C360S245000, C360S294300
Reexamination Certificate
active
06924166
ABSTRACT:
A process for the fabrication of devices that integrate protected microstructures, comprising the following steps: forming, in a body of semiconductor material, at least one microstructure having at least one first portion and one second portion which are relatively mobile with respect to one another and are separated from one another by at least one gap region, which is accessible through a face of the body; and sealing the gap. The sealing step includes depositing on the face of the body a layer of protective material, in such a way as to close the gap region, the protective layer being such as to enable relative motion between the first portion and the second portion of the microstructure.
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Baldo Lorenzo
Del Sarto Marco
Frezza Giovanni
Sassolini Simone
Bennett II Harold H.
Jorgenson Lisa K.
Seed IP Law Group PLLC
Smith Matthew
STMicroelectronics S.r.l.
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