Process for removing seams in tungsten plugs

Details Process for removing seams in tungsten plugs Process for removing seams in tungsten plugs

1997-07-14

1999-01-19

Martin-Wallace, Valencia

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257751, 257763, H01L 2348, H01L 2940

Patent

active

058616713

ABSTRACT:
A method for fabricating seamless, tungsten filled, small diameter contact holes, has been developed. The process features initially creating a tungsten plug, in the small diameter contact hole, and filling or repairing, seams or voids in the tungsten plug, with an additional layer of selectively deposited tungsten.

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patent: 5422308 (1995-06-01), Nicholls et al.
patent: 5422310 (1995-06-01), Ito
patent: 5430328 (1995-07-01), Hsue

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