Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Removal of imaged layers
Patent
1992-07-17
1995-08-22
Bowers, Jr., Charles L.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Removal of imaged layers
430311, 430312, 430313, 430314, G03C 500
Patent
active
054439426
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
The present invention relates to a process and an apparatus for removing a resist which are applicable in microprocessing methods representatively such as photolithography. The process and the apparatus of the present invention for removing a resist are effective particularly in the production of an ink jet recording head.
BACKGROUND OF THE INVENTION
In the microprocessing methods such as photolithography and the like, a resist is used comprising photosensitive resin or the like in order to form a minute pattern. (Said resist is often called "photoresist" since it has a photosensitivity, but it will be hereinafter referred to as "resist".)
For instance, in the case of producing a semiconductor element, a resist is applied onto a base member such as wafer, and after being subjected to light exposure, a soluble portion of the resist is removed in the development step or the successive removing step.
As the resist removing methods in the prior art, there are a spraying method wherein a resist removing liquid (which is usually called "developing solution" or "removing solution" in the field of photolithography, but in the following, it will be collectively referred to as "removing liquid") is sprayed to a resist on the base member to thereby remove the resist from the base member, and a dipping method wherein the base member having a resist disposed thereon is dipped into a removing liquid to thereby remove the resist on the base member. When required, a treatment for promoting the removal of the resist such as ultrasonic vibration treatment, heating treatment, stirring treatment, pressure circulating treatment, or the like is performed for the removing liquid. After the removal of the resist having been accomplished in this way, the base member is usually washed with the use of a rinsing liquid, followed by subjecting the washed base member to drying.
As for these conventional resist removing methods, there are such problems as will be described below.
That is, usually, finer the pattern formed, the greater the period of time for removing the resist is prolonged. However, when a removing liquid having a high resist solubility is used in order to shorten this period of time, other portion of the resist than the portion thereof to be removed is often swelled to cause a bridge, meander, mutual leaning or trailing between the adjacent resist patterns. In the worst case, said other portion of the resist than the portion thereof to be removed is dissolved, wherein the resulting pattern becomes narrowed in width. Thus, it is difficult to obtain a highly precise resist pattern of a desired size and shape in any case.
On the other hand, in the case where removal of the resist is carried out over a relatively long period of time using a removing liquid which is not so high in solubility, without concern about shortening of the removing period of time, it is possible to form a minute pattern with a satisfactory precision. However in reverse, a considerably large amount of the removing liquid is required in this case. In addition, problems are occasionally caused relative to defective removal that residues of the resist occur particularly at the fine portions, and insufficient removal that the resist portions, which were once removed, are returned to adhere, resulting in negative influences to the successive steps. These problems are hardly resolved in the prior art even by employing the foregoing treatments for promoting the removal of the resist.
Now, as one of the principal and effective methods for producing an ink jet recording head, there is a method in which removal of the resist is performed, which is described in U.S. Pat. Nos. 4,657,631 or 4,775,445 and which is schematically shown in FIG. 4(A) through FIG. 4(F). This method will be later detailed. In this method, on a base member 40 shown in FIG. 4(A) having an energy generating body 41 capable of generating an energy to be utilized for discharging ink disposed thereon is disposed a layer 42 comprising, for example, a positive type p
Bowers Jr. Charles L.
Canon Kabushiki Kaisha
Letscher Geraldine
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