Process for removing contaminant

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

134 1, 134 221, 156644, 156646, 156651, 156655, 1566591, 156668, 156902, B44C 122, B29C 3700, C03C 1500, C03C 2506

Patent

active

046541152

ABSTRACT:
Contaminant is removed from holes by etching in a gaseous plasma by first removing contaminant from the vicinity of the edges of the hole. Next, a mask is provided in the vicinity of the edges to prevent etching by contacting with a gaseous plasma which is different from the gaseous plasma employed in the first etching step. The holes are then etched in a gaseous plasma to remove contaminant from the interior of the holes in the vicinity of the center of the holes, whereby the mask protects the edges from being etched.

REFERENCES:
patent: 4328081 (1982-05-01), Fazlin
patent: 4351697 (1982-09-01), Shanefield et al.
patent: 4496420 (1985-01-01), Frohlich et al.
patent: 4582564 (1986-04-01), Shanefield et al.
patent: 4599134 (1986-07-01), Babu et al.

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