Process for removing a polyimide resin by dissolution

Details Process for removing a polyimide resin by dissolution Process for removing a polyimide resin by dissolution

1990-04-11

1990-12-11

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 3, 134 34, 156656, 1566591, 156655, 156666, 156668, 156902, 252 792, 252 795, 427 98, B44C 122, C23F 102, B29C 3700, C03C 1500

Patent

active

049768085

ABSTRACT:
When a TAB tape is manufactured from a substrate which has been prepared by forming an electrolessly plated cooper layer on a polyimide resin, and heat treated at a temperature of 120.degree. C. to 420.degree. C., any unwanted portion of the resin is dissolved in a solution containing hydrazine hydrate after the copper layer has been patterned to form leads, and any unwanted portion thereof removed by etching, whereby the unwanted portions of the resin are substantially removed, but an organic substance is formed to remain as an undissolved film. This film is removed by treatment with one or two of a solution containing ammonium ions, a solution containing halogen ions and a solution which can dissolve copper.

REFERENCES:
patent: 3820994 (1974-06-01), Lindberg et al.
patent: 4632290 (1987-01-01), Leyden et al.
patent: 4650545 (1987-03-01), Laakso et al.

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