Process for regenerating chemical copper plating solution

Details Process for regenerating chemical copper plating solution Process for regenerating chemical copper plating solution

1980-06-17

1982-04-13

Prescott, Arthur C.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

204130, 204151, 204DIG13, B01D 1302, C25D 2116

Patent

active

043246290

ABSTRACT:
During recyclic use of a chemical copper plating solution, counter anions to copper ions, anions formed by oxidation of a reducing agent, and carbon dioxide by absorption of carbon dioxide from air, which all have an inhibiting effect upon the plating, and also sodium ions having no inhibiting effect are accumulated in the plating solution.
These accumulated ions can be removed by electrodialysis. Particularly, regeneration can be satisfactorily regenerated by adjusting the pH of used chemical plating solution to 2-11 before the electrodialysis, and using a selectively monovalent anion permeable membrane as an anion exchange membrane at the electrodialysis.

REFERENCES:
patent: 3761369 (1973-09-01), Tirrell
patent: 3764503 (1973-10-01), Lancy et al.
patent: 4105532 (1978-08-01), Haines et al.
Kirk-Othmer, Encyclopedia of Chemical Technology, "Electrodialysis", vol. 7, 2nd ed., pp. 849+850 (1965).

Affiliated with

Also associated with

Rating

Process for regenerating chemical copper plating solution does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for regenerating chemical copper plating solution, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for regenerating chemical copper plating solution will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1416479