Process for reforming surface of substrate, reformed...

Details Process for reforming surface of substrate, reformed... Process for reforming surface of substrate, reformed...

2005-02-22

2005-02-22

Versteeg, Steven (Department: 1753)

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

C204S298040, C204S298110, C204S298260

Reexamination Certificate

active

06858115

ABSTRACT:
Sputtering particles are deposited immediately after activating a surface of a substrate composed of a carbon-containing material. Accordingly, a process for reforming a surface of a substrate, a substrate with a reformed surface, and an apparatus therefor are provided in which the depositability and adhesiveness of the sputtering particles are improved. A vacuum ultraviolet light is generated by a laser beam. A surface of a substrate composed of a carbon-containing material is exposed to the generated vacuum ultraviolet light. As a result, the surface of the substrate is activated. Simultaneously therewith, a sputtering particles-generating device generates sputtering particles, such as neutral atoms, ions and clusters. The resultant sputtering particles are deposited on the activated surface of the substrate. Since the sputtering particles are deposited immediately after the surface of the substrate is activated, they are adhered firmly on the surface of the substrate.

REFERENCES:
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H. Tokunaga, et al., “Dependence of Cu Nucleus Density on PET Surface with Single Shot Irradiation of ArF Excimer Laser”, (1 page) (with English translation of Related Portion) Extended Abstracts, The 63rdAutum Meeting: The Japan Society of Applied Physics, 2002.

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