Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate
2005-02-08
2005-02-08
Smith, Matthew (Department: 2825)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With stress relief
C257S688000, C257S666000, C257S780000, C257S676000, C257S692000, C257S778000, C257S784000, C257S686000, C438S108000, C438S106000, C438S121000, C438S612000, C438S669000, C438S109000, C438S123000, C438S617000
Reexamination Certificate
active
06853058
ABSTRACT:
A semiconductor package assembly is disclosed having a semiconductor die receiving member configured to accept a semiconductor die in either the flip-chip or the wirebond orientations. First contact sites on a die receiving surface provide electrical connection with a flip-chip component. Second contact sites provide electrical connection with a wirebond component. Electrically conductive traces connect the first and second contact sites with terminal contact sites. The semiconductor package assembly may further include the flip-chip or wirebond component mounted over the die receiving surface. Further, the assembly may also include a mounting substrate in electrical connection with the terminal contact sites.
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Micro)n Technology, Inc.
Smith Matthew
Workman Nydegger
Yevsikov Victor V
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