Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-10-28
1987-08-25
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156629, 156646, 156651, 156666, 156902, 252 791, C23F 100, B44C 122, C03C 1500, C03C 2506
Patent
active
046891110
ABSTRACT:
A method for improving the adhesion of a polymer such as an epoxy resin to a metal such as copper wherein the metal surface to be adhered is sequentially exposed to a pressurized stream of a slurry containing suspended metal oxide particles followed by treating the metal oxide treated film in a gas plasma containing a fluorohydrocarbon.
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patent: 3455775 (1969-07-01), Pohl et al.
patent: 4416725 (1983-11-01), Cuomo et al.
patent: 4557796 (1985-12-01), Druchke et al.
IBM Technical Disclosure Bulletin, vol. 26, #7A, "Enhanced Adhesion to Interlevel Polyimide", Cote, W. and Holland, S.
IBMTDB, vol. 26, #10B, "Improved Hydrophilic Property by Water Plasma", Lo, J. and Lu, J.
IBMTDB, vol. 27, No. 6; "Plasma Polymer Surface Adhesion Modification Method", Nguyen, S. and Underhill, J.
IBMTDB, vol. 26, No. 5; "Plasma Treatment to Improve Photoresist Adhesion to Various Substrates"; Auda, B.
IBMTDB, vol. 26, No. 3B; "Surface Treatment of Polyimide to Facilitate Adhesion of Metallic Surface Layers"; Collins, G. and Morgan, W.
IBMTDB, vol. 25, No. 12; "Improved Adhesion Between Metal and Polymer Surfaces"; Cuomo, J., Guarnieri, C. and Yee, D.
IBMTDB, vol. 22, No. 1; "Method for Improving Adhesion of Polyimides", Abrahmovich, K., Gleason, R. and Motsiff, W.
Chan Kevin K.
Malueg Vicki J.
International Business Machines Corp.
Powell William A.
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