Process for production of semiconductor substrate

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation

Reexamination Certificate

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C438S466000, C438S409000, C438S458000, C257SE21570

Reexamination Certificate

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07148119

ABSTRACT:
A process for producing a semiconductor substrate is provided which comprises steps of forming a porous layer on a first substrate, forming a nonporous monocrystalline semiconductor layer on the porous layer of the first substrate, bonding the nonporous monocrystalline layer onto a second substrate, separating the bonded substrates at the porous layer, removing the porous layer on the second substrate, and removing the porous layer constituting the first substrate.

REFERENCES:
patent: 4064521 (1977-12-01), Carlson
patent: 4116751 (1978-09-01), Zaromb
patent: 4426657 (1984-01-01), Abiru et al.
patent: 4555586 (1985-11-01), Guha et al.
patent: 4670763 (1987-06-01), Ovshinsky et al.
patent: 4727047 (1988-02-01), Bozler et al.
patent: 5175610 (1992-12-01), Kobayashi
patent: 5248621 (1993-09-01), Sano
patent: 5250460 (1993-10-01), Yamagata et al.
patent: 5277748 (1994-01-01), Sakaguchi et al.
patent: 5278092 (1994-01-01), Sato
patent: 5278093 (1994-01-01), Yonehara
patent: 5285078 (1994-02-01), Mimura et al.
patent: 5290712 (1994-03-01), Sato et al.
patent: 5320907 (1994-06-01), Sato
patent: 5331180 (1994-07-01), Yamada et al.
patent: 5362683 (1994-11-01), Takenaka et al.
patent: 5363793 (1994-11-01), Sato
patent: 5371037 (1994-12-01), Yonehara
patent: 5374564 (1994-12-01), Bruel
patent: 5403771 (1995-04-01), Nishida et al.
patent: 5433168 (1995-07-01), Yonehara
patent: 5453394 (1995-09-01), Yonehara et al.
patent: 5457058 (1995-10-01), Yonehara
patent: 5459081 (1995-10-01), Kajita
patent: 5466631 (1995-11-01), Ichikawa et al.
patent: 5536361 (1996-07-01), Kondo et al.
patent: 5644156 (1997-07-01), Suzuki et al.
patent: 5670411 (1997-09-01), Yonehara et al.
patent: 5811348 (1998-09-01), Matsushita et al.
patent: 5854123 (1998-12-01), Sato et al.
patent: 5856229 (1999-01-01), Sakaguchi et al.
patent: 5863830 (1999-01-01), Bruel et al.
patent: 5869387 (1999-02-01), Sato et al.
patent: 5970361 (1999-10-01), Kumomi et al.
patent: 5980633 (1999-11-01), Yamagata et al.
patent: 6103598 (2000-08-01), Yamagata et al.
patent: 6107213 (2000-08-01), Tayanaka
patent: 6121112 (2000-09-01), Sakaguchi et al.
patent: 6121117 (2000-09-01), Sato et al.
patent: 6127281 (2000-10-01), Sakaguchi et al.
patent: 6133112 (2000-10-01), Iwane et al.
patent: 6140209 (2000-10-01), Iwane et al.
patent: 6143629 (2000-11-01), Sato
patent: 6171932 (2001-01-01), Shiota
patent: 6187110 (2001-02-01), Henley et al.
patent: 6194245 (2001-02-01), Tayanaka
patent: 6326280 (2001-12-01), Tayanaka
patent: 6426274 (2002-07-01), Tayanaka
patent: 2003/0087503 (2003-05-01), Sakaguchi et al.
patent: 0417838 (1991-03-01), None
patent: 0 469 630 (1992-02-01), None
patent: 0469630 (1992-02-01), None
patent: 0469630 (1992-02-01), None
patent: 0499488 (1992-08-01), None
patent: 0536790 (1993-04-01), None
patent: 0536790 (1993-04-01), None
patent: 0 553 859 (1993-08-01), None
patent: 0 553 861 (1993-08-01), None
patent: 0553852 (1993-08-01), None
patent: 0553859 (1993-08-01), None
patent: 0553860 (1993-08-01), None
patent: 0554795 (1993-08-01), None
patent: 0584777 (1994-03-01), None
patent: 0618624 (1994-10-01), None
patent: 0757377 (1997-02-01), None
patent: 0797 258 (1997-09-01), None
patent: 0793263 (1997-09-01), None
patent: 0797258 (1997-09-01), None
patent: 2211991 (1989-07-01), None
patent: 60-196955 (1985-10-01), None
patent: 60-196955 V (1985-10-01), None
patent: 62-108539 V (1987-05-01), None
patent: 62-279625 (1987-12-01), None
patent: 03-70156 (1991-03-01), None
patent: 4-034961 (1992-02-01), None
patent: 5-021338 (1993-01-01), None
patent: 5-211128 (1993-08-01), None
patent: 05-211128 (1993-08-01), None
patent: 5-217827 (1993-08-01), None
patent: 5-217981 (1993-08-01), None
patent: 5-218464 (1993-08-01), None
patent: 05-283722 (1993-10-01), None
patent: 06-45622 (1993-10-01), None
patent: 5-299362 (1993-11-01), None
patent: 06-45622 (1994-02-01), None
patent: 07-79016 (1995-03-01), None
patent: 07-211602 (1995-08-01), None
patent: 07-302889 (1995-11-01), None
patent: 07-326719 (1995-12-01), None
patent: 9-162090 (1997-06-01), None
patent: 92/09104 (1992-05-01), None
G.W. Cullen, ed., Journal of Crystal Growth, vol. 63, No. 3, pp. 429-590, Oct. 1993 (see p. 547.
C. Harendt et al., “Silicon on Insulator Material by Wafer Bonding,” Journal of Electronic Materials, vol. 20, No. 3, pp. 267-277, Mar. 1991.
H. Baumgart et al., “Light Scattering Topography Characterization of Bonded SOI Wafers,” The Electrochemical Society, Extended Abstracts, Abstract No. 493, vol. 91-2, pp. 733-734, Oct. 1991.
C. Hunt et al., “Thinning of Bonded Wafers: Etch-Stop Approaches,” The Electrochemical Society, Extended Abstracts, Abstract No. 471, vol. 91-2, pp. 696-697, Oct. 1991.
A. Uhlir, Jr., “Electrolytic Shaping of Germanium and Silicon,” The Bell System Technical Journal, vol. XXXV, pp. 333-347, Mar. 1956.
R.P. Holmstrom, “Complete dielectric isolation by highly selective and self-stopping formation of oxidized porous silicon,” Applied Physics Letters, vol. 42, No. 4, pp. 386-388, Feb. 1983.
T. Unagami, “Formation Mechanism of Porous Silicon Layer by Anodization in HF Solution,” Journal of the Electrochemical Society, vol. 127, No. 2, pp. 476-483, Feb. 1980.
K. Imai, “A New Dielectric Isolation Method Using Porous Silicon,” Solid State Electronics, vol. 24, pp. 159-164, 1981.
Sato, Extended Abstracts,Elect. Chem. Soc., vol. 94-1, pp. 705-706 (1994).
V. Labunov, “Heat Treatment Effect on Porous Silicon,”Thin Solid Films, 137 (1986) 123-134.
T. Abe et al. “Silicon Kesshou to Doping (Silicon Crystal and Doping)”, Maruzen Co., Ltd., 1986 (with partial translation).
K. Imai et al., “Crystalline Quality of Silicon Layer Formed by FIPOS Technology,”J. of Crystal Growth 63, 547-553 (1983).
T. Yonehara et al., “Epitaxial layer transfer by bond and etch back of porous Si”,Appl. Phys. Lett.64(16), 2108-2110 (1994).
Nikkei Microdevice, pp. 76-77 (1994) (with translation).
Extended Abstracts (the 57thAutumn Meeting, 1996); The Japan Society of Applied Physics (Abst. 8a-V-8) (with translation).
Extended Abstracts (The 44thSpring Meeting, 1997); The Japan Society of Applied Physics and Related Societies (Abstr. 31a-B-5) (with translation).
Extended Abstracts (The 59thAutumn Meeting, 1998); The Japan Society of Applied Physics (Abstr. 15a-YB-4) (with translation).
Y. Hashimoto, “Shin-Kagaku Yougo Jiten” (new chemical term dictionary), Sankyo Shuppan Co., Ltd., 6thEdn (1973) (definition of anodic oxidation) (with translation).
H. Tayanaka, et al., “Thin-Film Crystalline Silicon Solar Cells Obtained by Separation of a Porous Silicon Sacrificial Layer” 2d World Conf. and Exhibition on Photovoltaic Solar Energy Conversion (1998).
T. Ito et al. “Porous Silicon Crystal Prepared by Anodization”,Applied Physics(Japanese) vol. 57 No. 11 (1998) (no translation).
K. Barla, et al., “SOI Technology Using Buried Layers of Oxidized Porous Si”, pp. 11-15 (1987).
H. Baumgart, et al., “Light Scattering Topography Characterization Of Bonded SOI Wafers”, Extended Abstracts, Elect. Chem. Soc. 1stSymp., pp. 375-385 (1991).
G.W. Cullen, ed., Journal of Crystal Growth, vol. 63, No. 3, pp. 429-590, Oct. 1983 (see, e.g., p. 547.).
Extended Abstracts (57thAutumn Meeting, 1996), The Japan Society of Applied Physics (Abstr. 8a-V-8) (with translation).
Extended Abstracts (44thSpring Meeting, 1997), The Japan Society of Applied Physics and Related Societies (Abstr. 31a-B-5) (with translation).
Extended Abstracts (59thAutumn Meeting, 1998), The Japan Society of Applied Physics (Abstr. 15a-YB-4) (with translation).
Y. Hashimoto, “Shin-Kagaku Yougo Jiten” (New Chemical Term Dictionary), Sankyo Shuppan Co., Ltd., 6thEdn (1973) (definition of anodic oxidation) (with translation).
R.P. Holmstrom, et al. “Complete dielectric isolation by highly selective and self-stopping formation of oxidized porous silicon,” Applied Physics Letters, vol. 42, No.

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