Process for production of semiconductor device and cleaning devi

Details Process for production of semiconductor device and cleaning devi Process for production of semiconductor device and cleaning devi

1999-03-10

2000-11-07

Le, Vu A.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438128, 438600, H01L 2144

Patent

active

061436372

ABSTRACT:
The present invention provides a process for producing a semiconductor device, which comprises: a step of forming a metal wiring pattern on a semiconductor wafer, a step of arranging a plurality of the wiring pattern-formed semiconductor wafers and cleaning them with a cleaning solution (a cleaning step), a step of rotating the cleaned semiconductor wafers at a high speed to swing off the cleaning solution adhering to the semiconductor wafers (a swinging-off step), and a step of rinsing the cleaning solution-removed semiconductor wafers with pure water (a rinsing step). According to the present process for production of semiconductor device, the foreign matter and residue appearing in the step of formation of metal wiring pattern can be removed without incurring corrosion of the metal wiring and a semiconductor device of high quality can be produced at a low cost.

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patent: 5876509 (1999-03-01), Nam
patent: 5896875 (1999-04-01), Yoneda

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