Process for producing thin copper foil-clad circuit board substr

Details Process for producing thin copper foil-clad circuit board substr Process for producing thin copper foil-clad circuit board substr

1992-02-06

1993-09-07

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 156666, 156902, 252 794, C23F 100, B44C 122

Patent

active

052425401

ABSTRACT:
A process for producing a thin copper foil-clad circuit board substrate which comprises subjecting a copper foil-clad circuit board substrate (a) comprising an electrically insulating support overlaid on one or both sides with a copper foil having an average thickness of 12 .mu.m or more to etching with a copper-etching solution thereby to etch the whole surface of the copper foil at a predetermined etching rate selected from the range of from 0.01 to 0.4 .mu.m/sec, thereby to reduce the thickness of the copper foil on at least one side of the insulating support to 10 to 80% of its original thickness with the thickness variation of the remaining etched copper foil being within .+-.1.0 .mu.m on the basis of a desired thickness, wherein said copper foil-clad circuit board substrate (a) is one in which the surface of the copper foil is substantially free of adherent dust particles having an average particle diameter of 3 .mu.m or more.

REFERENCES:
patent: 4917758 (1990-04-01), Ishizuka et al.
patent: 4994139 (1991-02-01), Biermann et al.

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