Process for producing sputtering target

Details Process for producing sputtering target Process for producing sputtering target

1998-02-27

2000-06-13

Eley, Timothy V.

Abrading

Abrading process

Utilizing fluent abradant

451 38, 451 39, B24B 100

Patent

active

060742798

ABSTRACT:
The surface to be sputtered of a sputtering target is blasted with a blasting material in the form of a finely divided powder having particle diameters falling within the range of 10 to 500 .mu.m to remove impurities staining the surface to be sputtered. This blasting treatment is suitable especially for a sputtering surface having a raised portion thereon. Preferably the blasting treatment is effected in two stages: in the first stage, a blasting material powder with particle diameters of 50 to 500 .mu.m is used and, in the second stage, a blasting material powder with particle diameters of 10 to 110 .mu.m is used. The blast-treated surface has a uniform, isotropic and reduced surface roughness.

REFERENCES:
patent: 3662501 (1972-05-01), Mendel
patent: 3939613 (1976-02-01), Ayers
patent: 4714528 (1987-12-01), Takeuchi et al.
patent: 4909894 (1990-03-01), Uesugi et al.
patent: 5160675 (1992-11-01), Iwannoto et al.
patent: 5409415 (1995-04-01), Kawanami et al.
patent: 5455078 (1995-10-01), Kanzaki

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