Process for producing semiconductor device

Details Process for producing semiconductor device Process for producing semiconductor device

1997-01-21

1999-03-16

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

498114, 498464, 498465, H01L 21208

Patent

active

058829563

ABSTRACT:
A process for manufacturing a wafer dicing/bonding sheet of the present invention comprises a soft film, a pressure sensitive adhesive layer formed on the soft film, a processing film for polyimide type resin composed of a heat resistant resin which has been formed on the pressure sensitive adhesive layer and a polyimide adhesive layer formed on the processing film. It is preferred that the processing film be a polyethylene naphthalate film whose surface has been subjected to an alkyd release treatment. The present invention facilitates expansion to be conducted after the wafer dicing.

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patent: 5110388 (1992-05-01), Komyama et al.
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patent: 5316853 (1994-05-01), Shibata et al.
patent: 5411921 (1995-05-01), Negoro
patent: 5527998 (1996-06-01), Anderson et al.
patent: 5692297 (1997-12-01), Noda
patent: 5705016 (1998-01-01), Senoo et al.

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