Process for producing resist pattern and conductor pattern

Details Process for producing resist pattern and conductor pattern Process for producing resist pattern and conductor pattern

2011-01-18

2011-01-18

Duda, Kathleen (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

Reexamination Certificate

active

07871758

ABSTRACT:
This process for producing a resist pattern is a process for producing a resist pattern including: the step of laminating (a) a support having an upper surface on which copper exists, (b) an inorganic substance layer consisting of an inorganic substance supplied from an inorganic substance source, and (c) a photoresist layer consisting of a chemically amplified type negative photoresist composition, to obtain a photoresist laminate, the step of selectively irradiating active light or radioactive rays to the photoresist laminate, and the step of developing the (c) photoresist layer together with the (b) inorganic substance layer to form a resist pattern.

REFERENCES:
patent: 2002/0086934 (2002-07-01), Kawaguchi et al.
patent: 2003/0087187 (2003-05-01), Saito et al.
patent: 2003/0176044 (2003-09-01), Park
patent: 2003-140347 (2003-05-01), None
patent: WO 03/036387 (2003-05-01), None
Combined Office Action and Search Report issued in the counterpart Taiwanese Patent Application No. 094141756, dated Dec. 15, 2008.
International Search Report and Written Opinion from PCT/JP2005/022255 filed on Nov. 29, 2005.

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