Process for producing printed wiring boards

Details Process for producing printed wiring boards Process for producing printed wiring boards

1989-04-10

1992-10-13

Gorski, Joseph M.

Metal working

Method of mechanical manufacture

Electrical device making

29848, 427 97, H05K 312

Patent

active

051539870

ABSTRACT:
By using a composite film comprising an additive layer and an insulating layer containing an epoxy resin and a synthetic rubber as major components, printed wiring boards having a higher circuit density and higher reliability can be produced simply and effectively.

REFERENCES:
patent: 4389268 (1983-06-01), Oshima et al.
patent: 4585502 (1986-04-01), Uozu et al.
patent: 4770900 (1988-09-01), Seibel
patent: 4804615 (1989-02-01), Larson et al.

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