Process for producing printed wiring board and...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Reexamination Certificate

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C430S311000, C430S313000, C430S319000, C430S329000, C430S324000, C430S325000, C430S326000, C430S330000, C430S270100, C430S281100, C430S285100, C430S280100, C430S284100

Reexamination Certificate

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07338751

ABSTRACT:
An object of the present invention is to provide a process for producing a printed wiring board, which is advantageous not only in that the reduction in size and increase in density of the wiring board are achieved and further the steps are simplified, but also in that the connection reliability of mount parts and the yield are improved, and a photosensitive resin composition used in the process. The present invention is directed to a process for producing a printed wiring board, comprising the steps of: (i) forming a solder resist on a wiring board having a circuit; (ii) laminating a preliminarily molded layer of a photosensitive resin composition on the solder resist; (iii) subjecting the layer of the photosensitive resin composition to exposure and development to form a resist pattern of the photosensitive resin composition; (iv) subjecting the entire surface of the resultant board to electroless plating, and (v) stripping the layer of the photosensitive resin composition, wherein the steps are conducted in this order, as well as a photosensitive resin composition and the layer thereof used in the process.

REFERENCES:
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patent: 5922509 (1999-07-01), Kautz et al.
patent: 5935761 (1999-08-01), Hwang et al.
patent: 6703181 (2004-03-01), Hayashi et al.
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patent: 6-282069 (1994-10-01), None
patent: 06-317904 (1994-11-01), None
patent: 09-265188 (1997-10-01), None
patent: 9-265188 (1997-10-01), None
patent: 10-051107 (1998-02-01), None
patent: 10-128897 (1998-05-01), None
patent: 11-284336 (1999-10-01), None
patent: 11-327137 (1999-11-01), None
patent: 2000-275831 (2000-10-01), None
patent: 2001-048982 (2001-02-01), None
Machine-assisted English translation of JP 10-051107, provided by JPO.
Machine-assisted English translation of JP 9-265188, provided by JPO.
Machine-assisted English translation of JP 6-282069, provided by JPO.
International Search Report, PCT/JP02/03147, Japanese Patent Office, Jun. 18, 2002, 4 pages.
English Language Translation of International Preliminary Examination Report for corresponding international application, completed Feb. 10, 2003.
Patent Abstracts of Japan, English Abstract of JP 11-327137, published Nov. 26, 1999.
Office Action issued in the corresponding Japanese Application No. 2002-577648 on Mar. 13, 2007.

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