Process for producing printed wiring board

Details Process for producing printed wiring board Process for producing printed wiring board

1992-11-02

1994-05-10

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29846, 174266, 427306, H01K 310

Patent

active

053096320

ABSTRACT:
A process for producing a printed wiring board characterized by forming a nickel layer by electroless plating and a copper layer formed thereon by electroless plating, or forming a copper undercoating layer before the nickel layer by electroless plating can produce printed circuit boards excellent in resistance to electrolytic corrosion and suitable for mounting parts in high density.

REFERENCES:
patent: 3154478 (1964-10-01), Lee
patent: 3322881 (1967-05-01), Schneble, Jr. et al.
patent: 3606677 (1971-09-01), Ryan
patent: 3672986 (1972-06-01), Schneble, Jr. et al.
patent: 4136216 (1979-01-01), Feldstein
patent: 4512829 (1985-04-01), Ohta et al.
patent: 4572925 (1986-02-01), Scarlett
RCA Notes Tech Notes Apr. 1968 by Robert J. Ryan.

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