Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-12-18
1987-11-10
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29852, 156634, 156656, 156666, 156902, 204 15, 20419214, 252 792, C23F 102, B44C 122, C03C 1500, C03C 2506
Patent
active
047055928
ABSTRACT:
A process for producing printed circuits including a dry substrate activation process and copper deposition without electroless plating is disclosed. The process requires fewer wet chemical baths, is less environmentally hazardous, and more efficient than conventional processes. Initially, sacrificial copper layers are laminated to the surface of a prepreg substrate and through holes are drilled therein. The sacrificial layer is then removed by etching and copper is sputter deposited upon the substrate surface and the walls of the through holes. Photoresist is then applied, exposed and developed to create the desired pattern of circuit lines. Next, copper is deposited in the photoresist channels and on the through hole walls by electroplating. After the photoresist is stripped, the exposed sputtered copper is removed by differential etching.
REFERENCES:
patent: 2982625 (1961-05-01), Saubestre
patent: 3675318 (1972-07-01), Merkenschlager
patent: 4521280 (1985-06-01), Bahrle et al.
patent: 4556628 (1985-12-01), Greschner et al.
patent: 4581301 (1986-04-01), Michaelson
Czepluch, Method of Improving the Adhesion of Metallic Layers on Curable Plastics, IBM TDB, 11/84, vol. 27, No. 6, pp. 3208-3209.
Schneider et al., Method of Producing Printed Circuits by the Additive Process, IBM TDB, vol. 26, No. 8, 2/84, p. 4816.
Bahrle Dieter
Schwerdt Friedrich
Stehling Jurgen H.
Beckstrand Shelley M.
International Business Machines - Corporation
Klitzman Maurice H.
Powell William A.
Schecter Manny W.
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