Process for producing printed circuit board

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430319, 430325, 430328, 430330, 430394, 427 98, B05D 512, G03L 500

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048761770

ABSTRACT:
A process for producing a printed circuit board, which comprises the steps of forming a layer comprising a photosensitive resin composition on an insulating substrate having on its surface an adhesive layer adherent to a metal being subsequently plated thereon; exposing said layer comprising a photosensitive resin composition to an actinic radiation in a manner so as to form on said layer a negative pattern of a conductor circuit pattern and to semicure said negative pattern to an extent sufficient to keep it from erosion by a plating solution; developing by dissolving away with a solvent the uncured areas not exposed to said actinic radiation, thereby to form a plating resist on the areas of said negative pattern; chemically plating said conductor circuit pattern areas not covered with said plating resist, thereby to form a conductor circuit; and carrying out a curing treatment to cure completely said resist. According to this invention, it is possible to provide a printed circuit board of higher reliability compared with conventional processes.

REFERENCES:
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patent: 4216246 (1980-08-01), Iwasaki et al.
patent: 4456679 (1984-06-01), Leyrer et al.
patent: 4460427 (1984-07-01), Haney et al.
patent: 4469777 (1984-09-01), O'Neil
patent: 4470883 (1984-09-01), Eichelberger et al.
patent: 4567062 (1986-01-01), Fan
patent: 4687730 (1987-08-01), Eron

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