Process for producing printed circuit board

Details Process for producing printed circuit board Process for producing printed circuit board

1991-04-23

1992-12-22

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 29848, 156634, 156650, 156656, 1566591, 156666, 156902, B44C 122, C23F 102

Patent

active

051731509

ABSTRACT:
A process for producing a printed circuit board which can mainly shield electromagnetic waves generated therefrom, a printed circuit board having printed thereon printed devices, a multilayered printed circuit board, or a printed circuit board for mounting chip devices, all of which have high reliability, using a printed circuit board obtained by preparing a semicured resin-based copper-clad laminate by continuous pressing by means of a double-belt pressing method or a batch-wise continuous pressing in which one laminate is produced by press molding between a pair of hot platens, the semicured resin-based copper-clad laminate having a copper foil peel strength of 0.2 kg/cm or more, preferably 0.3 kg/cm or more, and 90% or less of the peel strength thereof as measured after the resin is completely cured, subsequently forming a predetermined printed circuit by etching, and then pressing the resulting semicured resin-based printed circuit board, thereby to exist the conductor surface on almost the same level with the substrate surface.

REFERENCES:
patent: 4404059 (1983-09-01), Livshits et al.
patent: 4606787 (1986-08-01), Pelligrino
patent: 4631100 (1986-12-01), Pellegrino

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