Process for producing printed circuit board

Details Process for producing printed circuit board Process for producing printed circuit board

1989-04-10

1991-01-08

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 29852, 156634, 156656, 1566591, 156660, 156666, 156902, 156904, 204 141, 427 431, 427 531, 427 96, 430296, 430313, 430318, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

049832522

ABSTRACT:
In a process for fabricating a printed circuit board, a positive resist layer is electrodeposited on a copper clad laminate to ensure that the walls of through-holes in the substrate are completely coated with the resist, or alternatively, a film having a positive resist layer coated thereon is thermocompressed onto the copper clad laminate with the film being in contract with the latter, so as to cover both top and bottom of each through-hole. By subsequent treatments including resist exposure, development, copper foil etching and resist stripping, a high-density wiring pattern can be formed on the substrate in a uniform and consistent way even if through-holes exist in the substrate.

REFERENCES:
patent: 3535137 (1970-10-01), Haller et al.
patent: 3794510 (1974-02-01), Scala et al.
patent: 4521262 (1985-06-01), Pellegrino
patent: 4666818 (1987-05-01), Lake et al.
patent: 4673457 (1987-06-01), Ishikawa et al.
patent: 4698294 (1987-10-01), Lau et al.
patent: 4710262 (1987-12-01), Weed
patent: 4746399 (1988-05-01), Demmer et al.
patent: 4751172 (1988-06-01), Rodriguez et al.
patent: 4795694 (1989-01-01), Groeber et al.
Shimada et al., "Application of a Positive Working Liquid Photoresist for the Internal Layer of Multilayer Printed Wiring Board," Printed Circuit World Conventiona IV, Jun. 2-5, 1987, Tokyo, Japan, pp. 1-24, WCIV-62,
"Nikkei Microdevice", Feb. 1988, p. 115.

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