Process for producing multilayer printed circuit boards

Details Process for producing multilayer printed circuit boards Process for producing multilayer printed circuit boards

1996-05-30

1999-08-31

Ford, John M.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

216 17, 428901, 1566341, 252 623R, H01L 21306, B23F 118, B44C 122

Patent

active

059452587

ABSTRACT:
A process for producing a multilayer printed circuit board produced characterized by using a special thermosetting epoxy resin composition comprising (a) an epoxy resin, (b) a crosslinking agent and (c) a polyfunctional epoxy resin, for forming a thermosetting copper-clad adhesive resin sheet, which cover an interlayer circuit plate, followed by etching of cured adhesive resin for forming holes for interstitial via holes (IVH) having a small diameter using a special etching solution comprising (A) an amine as a solvent, (B) an alkali metal compound, and (C) an alcohol as a solvent, is suitable for mass production of multilayer printed circuit boards having IVH excellent in connection reliability and electrical properties.

REFERENCES:
patent: 5532105 (1996-07-01), Yamadera et al.
patent: 5681485 (1997-10-01), Yamagami et al.
patent: 5729897 (1998-03-01), Schmidt et al.
patent: 5758413 (1998-06-01), Chong et al.
patent: 5761801 (1998-06-01), Gebhardt et al.

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