Process for producing multilayer printed circuit boards

Details Process for producing multilayer printed circuit boards Process for producing multilayer printed circuit boards

1999-03-25

2000-11-28

Ford, John M.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

427207, H01L 21306, C23C 3002, B23F 1018

Patent

active

061533599

ABSTRACT:
An etching solution comprising (A) an amine as a solvent, (B) an alkali metal compound, and (C) an alcohol as a solvent, this etching solution being a non-aqueous solution. This etching solution is-effective for etching a cured epoxy resin layer for forming holes for interstitial via holes having a small diameter, in the production of a multilayer printed circuit board. This etching solution is particularly effective for etching a cured epoxy resin layer formed from a thermosetting epoxy resin composition including (a) an epoxy resin, (b) a crosslinking agent, and (c) a polyfunctional epoxy resin, which forms a thermosetting copper-clad adhesive resin sheet which covers an interlayer circuit plate of a multilayer printed circuit board.

REFERENCES:
patent: 5945258 (1999-08-01), Shimizu et al.

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